R&D Engineer IC Design H-1B Salary

245 certified H-1B filings list the job title R&D Engineer IC Design (FY2023–FY2026). The median offered base salary is $173,930; the middle half of filings fall between $151,216 and $199,453. The largest sponsor for this title is Broadcom Corporation (150 filings).

245
certified filings
$173,930
Median base salary
$151,216
25th pct
$199,453
75th pct
$205,445
90th pct
$133,141
10th pct
Estimates from public U.S. Department of Labor records — wages are employer-attested offered wages, not verified salaries paid; counts are filings, not people. Not legal, financial, or career advice. See our disclaimer & terms.
Data: DOL filings FY2023–FY2026 (through June 2026) · Page updated November 2026
$133,141$173,930 median$205,445

Salary by fiscal year

YearFilingsMedian
FY202657$173,730
FY202579$199,453
FY202460$163,226
FY202349$177,044

Top cities

CityFilingsMedian
San Jose, CA133$180,003
Irvine, CA37$152,360
Fort Collins, CO9$141,960
Austin, TX8$151,216
San Diego, CA8$163,322
Andover, MA7$136,323
Colorado Springs, CO7$131,186
Broomfield, CO5$146,390
Mendota Heights, MN3$100,339
Chandler, AZ2$148,481
Colorado Spring, CO1$133,141
Suite 400, TX1$159,713

R&D Engineer IC Design salary by employer

Top 6 sponsors by number of filings. Click a column to sort.

EmployerFilingsMedian salary
Broadcom Corporation150$167,691
LSI Corporation58$174,112
Avago Technologies US Inc.32$180,003
Avago Technologies Wireless (USA) Manufacturing LLC3$141,960
Brocade Communications Systems1$173,730
Brocade Communications Systems LLC1$177,341

Related job titles

Estimates from public U.S. Department of Labor records — wages are employer-attested offered wages, not verified salaries paid. Not legal, financial, or career advice. Full disclaimer